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Atomic Layer Deposited RuO2 Diffusion Barrier for Next Generation Ru-Interconnects File

Kim, Youn-Hye , Kim, Minsu , Kotsugi, Yohei , Cheon, Taehoon , Mohapatra, Debananda , Jang, Yujin , Bae, Jong-Seong , Hong, Tae Eun , Ramesh, Rahul , An, Ki-Seok , et al

Article Issue Date2022-10 View84
Improvement of the Diffusion Barrier Performance of Ru by Incorporating a WNx Thin Film for Direct-Plateable Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Jeon, Chan-Wook , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-04 View50
Plasma-Enhanced Atomic Layer Deposition of TaCx Films Using Tris(neopentyl) Tantalum Dichloride and H-2 Plasma File

Kim, Tae-Ho , Eom, Tae-Kwang , Kim, Soo-Hyun , Kang, Dae-Hwan , Kim, Hoon , Yu, Sangho , Lim, Jin Mook

Article Issue Date2011-05 View47
Self‐Formation of a Ru/ZnO Multifunctional Bilayer for the Next‐Generation Interconnect Technology via Area‐Selective Atomic Layer Deposition File

Mori, Yuki , Cheon, Taehoon , Kotsugi, Yohei , Kim, Youn‐Hye , Park, Yejin , Ansari, Mohd Zahid , Mohapatra, Debananda , Jang, Yujin , Bae, Jong‐Seong , Kwon, Woobin , et al

Article Issue Date2023-08 View90
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