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Amorphous boron nitride as an ultrathin copper diffusion barrier for advanced interconnects File

Kaya, Onurcan , Kim, Hyeongjoon , Kim, Byeongkyu , Galvani, Thomas , Colombo, Luigi , Lanza, Mario , Shin, Hyeon-Jin , Cole, Ivan , Suk Shin, Hyeon , Roche, Stephan

Article Issue Date2026-03 View15
Calibration of Nanoindentation Systems Based on the Reference Hardness of a Fused Silica File

Lee, Yun-Hee , Ahn, Seung-min , Kim, Ju-Young , Park, Chan-Pyung , Jane, Hee-Kwang

Article Issue Date2015-03 View177
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