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Atomic layer deposited nanocrystalline tungsten carbides thin films as a metal gate and diffusion barrier for Cu metallization File

Kim, Jun Beom , Kim, Soo-Hyun , Han, Won Seok , Lee, Do-Joong

Article Issue Date2016-07 View130
Characteristics of ALD tungsten nitride using B2H6, WF6, and NH3 and application to contact barrier layer for DRAM File

Kim, Soo-Hyun , Kim, Jun-Ki , Lee, Ju Hee , Kwak, Nohjung , Kim, Jinwoong , Jung, Sung-Hoon , Hong, Mi-Ran , Lee, Sang Hyeob , Collins, Josh , Sohn, Hyunchul

Article Issue Date2007-06 View239
Fluorine-free Plasma Enhanced Atomic Layer Deposited Ultrathin Tungsten Nitride Thin Films for Dual Diffusion Barrier Performance File

Seo, Kang-Min , Mohapatra, Debananda , Bae, Gun-Woo , Ansari, Mohd Zahid , Son, Yeseul , Jang, Yujin , Bae, Jong-Seong , Hong, Tae Eun , Kim, Soo-Hyun

Article Issue Date2023-12 View190
Preparation of tungsten-based thin films using a F-free W precursor and tert-butyl hydrazine via 2-and 3-step atomic layer deposition process File

Lee, Jin-Hyeok , Hidayat, Romel , Ramesh, Rahul , Roh, Hyeonsu , Nandi, Dip K. , Lee, Won-Jun , Kim, Soo-Hyun

Article Issue Date2022-03 View110
Ru/WNx Bilayers as Diffusion Barriers for Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Choi, Sang-Hyeok , Kim, Soo-Hyun

Article Issue Date2011-05 View101
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