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A comparative study of film properties of chemical vapor deposited TiN films as diffusion barriers for Cu metallization File

Kim, Soo‐Hyun , Chung, Deuk‐Seok , Park, Ki‐Chul , Kim, Ki‐Bum , Min, Seok‐Hong

Article Issue Date1999-04 View17

A highly efficient transition metal nitride-based electrocatalyst for oxygen reduction reaction: TiN on a CNT-graphene hybrid support File

Youn, Duck Hyun , Bae, Ganghong , Han, Suenghoon , Kim, Jae Young , Jang, Ji-Wook , Park, Hunmin , Choi, Sun Hee , Lee, Jae Sung

Article Issue Date2013-07 View44

Atomic Layer Deposition-A Versatile Toolbox for Designing/Engineering Electrodes for Advanced Supercapacitors File

Ansari, Mohd Zahid , Hussain, Iftikhar , Mohapatra, Debananda , Ansari, Sajid Ali , Rahighi, Reza , Nandi, Dip K. , Song, Wooseok , Kim, Soo-Hyun

Article Issue Date2024-01 View34

Atomistic kinetic Monte Carlo simulation on atomic layer deposition of TiN thin film File

Kim, Sangtae , An, Hyungmin , Oh, Sangmin , Jung, Jisu , Kim, Byungjo , Nam, Sang Ki , Han, Seungwu

Article Issue Date2022-10 View23

Effect of ion bombardment during chemical vapor deposition of TiN films File

Park, Ki‐Chul , Kim, Soo‐Hyun , Kim, Ki‐Bum

Article Issue Date2000-07 View22

Failure mechanism of a multilayer (TiN/Al/TiN) diffusion barrier between copper and silicon File

Kim, Soo-Hyun , Nam, KT , Datta, A , Kim, KB

Article Issue Date2002-11 View34

Improved diffusion barrier by stuffing the grain boundaries of TiN with a thin Al interlayer for Cu metallization File

Nam, Ki Tae , Datta, Arindom , Kim, Soo-Hyun , Kim, Ki-Bum

Article Issue Date2001-10 View18

Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2 File

Eom, Tae-Kwang , Sari, Windu , Choi, Kyu-Jeong , Shin, Woong-Chul , Kim, Jae Hyun , Lee, Do-Joong , Kim, Ki-Bum , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-08 View24

N-Doped Porous Graphitic Carbon Hybridized with CrN Nanocrystals: Electrocatalysis-Induced Li2S Three-Dimensional Growth and Enhanced Cathode Kinetics File

Zhou, Xueqin , Zhou, Ji , Sun, Longhua , Chen, Shang , Wang, Manyun , Meng, Xiaodong , Qu, Jin , Sun, Congkai , Yu, Zhong-Zhen , Huang, Yong , et al

Article Issue Date2023-11 View39

Optimization of Al interlayer thickness for the multilayer diffusion barrier scheme in Cu metallization File

Datta, A , Nam, KT , Kim, Soo-Hyun , Kim, KB

Article Issue Date2002-07 View30

Properties of plasma-enhanced atomic layer deposited TiCx films as a diffusion barrier for Cu metallization File

Choi, Sang-Kyung , Kim, Hangil , Kim, Junbeam , Cheon, Taehoon , Seo, Jong Hyun , Kim, Soo-Hyun

Article Issue Date2015-09 View13

The effect of ion beam bombardment on the properties of Ta(C)N films deposited from pentakis-diethylamido-tantalum File

Kim, Soo-Hyun , Im, Se-Joon , Kim, Ki-Bum

Article Issue Date2002-08 View37

TiN Nanoparticles on CNT-Graphene Hybrid Support as Noble-Metal-Free Counter Electrode for Quantum-Dot-Sensitized Solar Cells File

Youn, Duck Hyun , Seol, Minsu , Kim, Jae Young , Jang, Ji-Wook , Choi, Youngwoo , Yong, Kijung , Lee, Jae Sung

Article Issue Date2013-02 View50

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