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A bilayer diffusion barrier of ALD-Ru/ALD-TaCN for direct plating of Cu File

Kim, Soo-Hyun , Kim, Hyun Tae , Yim, Sung-Soo , Lee, Do-Joong , Kim, Ki-Su , Kim, Hyun-Mi , Kim, Ki-Bum , Sohn, Hyunchul

Article Issue Date2008-06 View137
A comparative study of film properties of chemical vapor deposited TiN films as diffusion barriers for Cu metallization File

Kim, Soo‐Hyun , Chung, Deuk‐Seok , Park, Ki‐Chul , Kim, Ki‐Bum , Min, Seok‐Hong

Article Issue Date1999-04 View193
Atomic layer deposition of high-quality Pt thin film as an alternative interconnect replacing Cu File

Han, Seung-Min , Nandi, Dip K. , Joo, Yong-Hwan , Shigetomi, Toshiyuki , Suzuki, Kazuharu , Nabeya, Shunichi , Harada, Ryosuke , Kim, Soo-Hyun

Article Issue Date2020-05 View72
Characterization of atomic layer deposited WNxCy thin film as a diffusion barrier for copper metallization File

Kim, Soo-Hyun , Oh, SS , Kim, HM , Kang, DH , Kim, KB , Li, WM , Haukka, S , Tuominen, M

Article Issue Date2004-03 View91
Facile nanocrystalline Ta3N5 synthesis for photocatalytic dye degradation under visible light File

Kim, Jae Young , Lee, Min Hee , Kim, Jun-Hyuk , Kim, Chang Woo , Youn, Duck Hyun

Article Issue Date2020-01 View91
Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition File

Park, Chaehyun , Kweon, Minjeong , Mohapatra, Debananda , Cheon, Taehoon , Bae, Jong-Seong , Jeong, Daeyoon , Jang, Hyunwoo , Shim, Seungwon , Park, Young-Bae , Kang, Youngho , et al

Article Issue Date2025-07 View82
Optimization of Mechanical Machining for Heat-Resistance Ta-W Alloy by Using Orthogonal Cutting Method File

Kim, Kyu-Sik , Kim, Sinwon , Mun, Chang Hyeon , Park, Jung Hyo , Kim, Donghoon , Yang, Seongho , Park, Hyung Wook

Article Issue Date2025-01 View49
Seedless electrodeposition of Cu thin films on ALD Ru diffusion barriers with different electrical properties File

Im, Byoungyong , Mun, Kiyeung , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2023-03 View126
TaCx Thin Films Prepared by Atomic Layer Deposition as Diffusion Barriers for Cu Metallization File

Hong, Tae Eun , Kim, Tae-Ho , Jung, Jae-Hun , Kim, Soo-Hyun , Kim, Hoon

Article Issue Date2014-01 View138
Theoretical band energetics of Ba(M0.5Sn0.5)O-3 for solar photoactive applications File

Borse, Pramod H. , Lee, Jae Sung , Kim, Hyun G.

Article Issue Date2006-12 View102
Transmission Electron Microscopy Study of the Failure Mechanism of the Diffusion Barriers (TiN and TaN) Between Al and Cu File

Kim, Soo-Hyun

Article Issue Date2017-01 View102
Understanding of electrochemical behaviors of niobium in molten LiCl–KCl eutectic for pyrochemical decontamination process File

Jeong, Gwan Yoon , Sohn, Sungjune , Jeon, Younghwan , Park, Jaeyeong

Article Issue Date2019-10 View122
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