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A comparative study of film properties of chemical vapor deposited TiN films as diffusion barriers for Cu metallization File

Kim, Soo‐Hyun , Chung, Deuk‐Seok , Park, Ki‐Chul , Kim, Ki‐Bum , Min, Seok‐Hong

Article Issue Date1999-04 View193
Improved diffusion barrier by stuffing the grain boundaries of TiN with a thin Al interlayer for Cu metallization File

Nam, Ki Tae , Datta, Arindom , Kim, Soo-Hyun , Kim, Ki-Bum

Article Issue Date2001-10 View82
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