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Atomic layer deposition of high-quality Pt thin film as an alternative interconnect replacing Cu File

Han, Seung-Min , Nandi, Dip K. , Joo, Yong-Hwan , Shigetomi, Toshiyuki , Suzuki, Kazuharu , Nabeya, Shunichi , Harada, Ryosuke , Kim, Soo-Hyun

Article Issue Date2020-05 View72
Highly conductive and flexible fiber for textile electronics obtained by extremely low-temperature atomic layer deposition of Pt File File

Lee, Jaehong , Yoon, Jaehong , Kim, Hyun Gu , Kang, Subin , Oh, Woo-Suk , Algadi, Hassan , Al-Sayari, Saleh , Shong, Bonggeun , Kim, Soo-Hyun , Kim, Hyungjun , et al

Article Issue Date2016-11 View105
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