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Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition File

Park, Chaehyun , Kweon, Minjeong , Mohapatra, Debananda , Cheon, Taehoon , Bae, Jong-Seong , Jeong, Daeyoon , Jang, Hyunwoo , Shim, Seungwon , Park, Young-Bae , Kang, Youngho , et al

Article Issue Date2025-07 View82
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