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Improvement of the Diffusion Barrier Performance of Ru by Incorporating a WNx Thin Film for Direct-Plateable Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Jeon, Chan-Wook , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-04 View111
Plasma-Enhanced Atomic Layer Deposition of TaCx Films Using Tris(neopentyl) Tantalum Dichloride and H-2 Plasma File

Kim, Tae-Ho , Eom, Tae-Kwang , Kim, Soo-Hyun , Kang, Dae-Hwan , Kim, Hoon , Yu, Sangho , Lim, Jin Mook

Article Issue Date2011-05 View101
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