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Effects of Back Metal on the DC and RF Characteristics of 3D Stacked InGaAs RF Device for Monolithic 3D RF Applications File

Jeong, Jaeyong , Kim, Seong Kwang , Kim, Jongmin , Geum, Dae-Myeong , Kim, Sanghyeon

Article Issue Date2023-04 View1
Stackable InGaAs-on-Insulator HEMTs for Monolithic 3-D Integration File

Jeong, Jaeyong , Kim, Seong Kwang , Kim, Jongmin , Geum, Dae-Myeong , Park, Juyeong , Jang, Jae-Hyung , Kim, Sanghyeon

Article Issue Date2021-05 View4
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