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Effects of Back Metal on the DC and RF Characteristics of 3D Stacked InGaAs RF Device for Monolithic 3D RF Applications File

Jeong, Jaeyong , Kim, Seong Kwang , Kim, Jongmin , Geum, Dae-Myeong , Kim, Sanghyeon

Article Issue Date2023-04 View0
High-performance InGaAs HEMTs on GaAs substrate using AlAs/GaAs superlattice buffer-assisted heterostructure growth File

Jeong, Jaeyong , Kim, Jongmin , Kim, Sanghyeon

Article Issue Date2025-03 View0
Influence of Channel Structure on the Subthreshold Swing of InGaAs HEMTs at Cryogenic Temperatures Down to 4 K File

Jeong, Jaeyong , Kim, Jongmin , Lee, Jisung , Suh, Yoon-Je , Rheem, Nahyun , Kim, Seong Kwang , Park, Juhyuk , Kim, Bong Ho , Kim, Joon Pyo , Park, Seung-Young , et al

Article Issue Date2024-05 View0
Thermal Studies of 3-D Stacked InGaAs HEMTs and Mitigation Strategy of Self-Heating Effect Using Buried Metal Insertion File

Jeong, Jaeyong , Kim, Seong Kwang , Suh, Yoon-Je , Shim, Joonsup , Beak, Woo Jin , Choi, Sung Joon , Kim, Joon Pyo , Kim, Bong Ho , Geum, Dae-Myeong , Kim, Jongmin , et al

Article Issue Date2024-08 View0
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