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3-D On-Chip Integration of GaN Power Devices on Power Delivery Network (PDN) With Direct Heat Spreading Layer Bonding for Heterogeneous 3-D (H3D) Stacked Systems File

Jeong, Jaeyong , Lee, Chan Jik , Choi, Sung Joon , Rheem, Nahyun , Song, Minseo , Suh, Yoon-Je , Kim, Bong Ho , Kim, Joon Pyo , Shim, Joonsup , Lee, Jiseon , et al

Article Issue Date2025-05 View0
A Mixture-Gas Edge-Computing Multi-Sensor Device with Generative Learning Framework File

Cho, Jeonghoon , Pyeon, You Jang , Kwon, Yeong Min , Kim, Yonggi , Yeom, Junyeong , Kim, Myeong Woo , Park, Chan Sam , Kim, In-Ho , Lee, Yun-Sik , Kim, Jae Joon

Article Issue Date2024-05 View143
Origami-structured Actuating Modules for Upper Limb Support File

Seo, Seongmin , Park, Wookeun , Lee, Dongman , Bae, Joonbum

Article Issue Date2021-07 View149
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