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Atomic-layer-deposited WNxCy thin films as diffusion barrier for copper metallization File

Kim, Soo-Hyun , Oh, Su Suk , Kim, Ki Bum , Kang, Dae-Hwan , Li, Wei-Min , Haukka, Suvi , Tuominen, Marko

Article Issue Date2003-06 View111
Characterization of atomic layer deposited WNxCy thin film as a diffusion barrier for copper metallization File

Kim, Soo-Hyun , Oh, SS , Kim, HM , Kang, DH , Kim, KB , Li, WM , Haukka, S , Tuominen, M

Article Issue Date2004-03 View91
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