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Cu direct electrodeposition using step current for superfilling on Ru-Al2O3 layer File

Kim, Myung Jun , Choe, Seunghoe , Kim, Hoe Chul , Lee, Seung-Joon , Kim, Soo-Hyun , Kwon, Oh Joong , Kim, Jae Jeong

Article Issue Date2014-11 View108
Improvement of the Diffusion Barrier Performance of Ru by Incorporating a WNx Thin Film for Direct-Plateable Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Jeon, Chan-Wook , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-04 View111
Nucleation-controlled growth of Cu thin films electrodeposited directly on ALD Ru diffusion barrier in additive-free electrolyte for Cu interconnect File

Im, Byoungyong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2023-04 View126
Seedless electrodeposition of Cu thin films on ALD Ru diffusion barriers with different electrical properties File

Im, Byoungyong , Mun, Kiyeung , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2023-03 View126
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