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Diffusion-controlled growth of Cu thin films electrodeposited directly on atomic-layer-deposited WC diffusion barrier for Cu interconnect File

Youn, Hongmin , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2021-08 View100
Direct Electrodeposition of Cu on Ru-Al2O3 Layer File

Kim, Myung Jun , Kim, Hoe Chul , Kim, Soo-Hyun , Yeo, Seungmin , Kwon, Oh Joong , Kim, Jae Jeong

Article Issue Date2013-01 View104
Influence of additives upon Cu thin film growth on atomic-layer-deposited Ru layer and trench-filling by direct electrodeposition File

Im, Byoungyong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2017-08 View107
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