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3-D On-Chip Integration of GaN Power Devices on Power Delivery Network (PDN) With Direct Heat Spreading Layer Bonding for Heterogeneous 3-D (H3D) Stacked Systems File

Jeong, Jaeyong , Lee, Chan Jik , Choi, Sung Joon , Rheem, Nahyun , Song, Minseo , Suh, Yoon-Je , Kim, Bong Ho , Kim, Joon Pyo , Shim, Joonsup , Lee, Jiseon , et al

Article Issue Date2025-05 View0
Determining the effect of added zirconium on the bond character in TiFe alloys using scanning Kelvin probe force microscopy File

Han, Huijun , Kim, Han-Jin , Kim, Hayoung , Sohm, So-Dam , Shim, Jae-Hyeok , Suh, Jin-Yoo , Shin, Hyung-Joon

Article Issue Date2020-07 View112
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