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Browsing by Keyword : B2H6

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Diffusion barriers between Al and Cu for the Cu interconnect of memory devices File

Kim, Soo-Hyun , Yim, Sung-Soo , Lee, Do-Joong , Kim, Ki-Su , Kim, Hyun-Mi , Kim, Ki-Bum , Sohn, Hyunchul

Article Issue Date2008-03 View122
Highly Conformal Amorphous W-Si-N Thin Films by Plasma-Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization File

Hong, Tae Eun , Jung, Jae-Hun , Yeo, Seungmin , Cheon, Taehoon , Bae, So Ik , Kim, Soo-Hyun , Yeo, So Jeong , Kim, Hyo-Suk , Chung, Taek-Mo , Park, Bo Keun , et al

Article Issue Date2015-01 View107
Improvement of Adhesion Performances of CVD-W Films Deposited on B2H6-Based ALD-W Nucleation Layer File

Kim, Choon-Hwan , Rho, Il-Cheol , Kim, Soo-Hyun , Sohn, Yong-Sun , Kang, Hyo-Sang , Kim, Hyeong-Joon

Article Issue Date2008-03 View89
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