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Showing results 9 to 11 of 11

Highly Conformal Amorphous W-Si-N Thin Films by Plasma-Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization File

Hong, Tae Eun , Jung, Jae-Hun , Yeo, Seungmin , Cheon, Taehoon , Bae, So Ik , Kim, Soo-Hyun , Yeo, So Jeong , Kim, Hyo-Suk , Chung, Taek-Mo , Park, Bo Keun , et al

Article Issue Date2015-01 View110
Potentiostatic electrodeposition of Cu thin films directly on ALD Ru diffusion barrier and trench-filling for Cu interconnect File

Im, Byoungyong , Kim, Sunjung , Kim, Soo-Hyun , Park, Kwangsuk

Article Issue Date2026-03 View20
Zirconium Metal Recovery from Irradiated Radioactive Zirconium Alloy via Chloride-Based Electrorefining and Thermal Decomposition of ZrCl File

Hur, Jungho , Jeon, Younghwan , Jeong, Gwan Yoon , Sohn, Sungjune , Choi, Sungyeol , Park, Jaeyeong

Article Issue Date2022-04 View139
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