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Atomic Layer Deposition of Ru for Replacing Cu-Interconnects File

Kotsugi, Yohei , Han, Seung-Min , Kim, Youn-Hye , Cheon, Taehoon , Nandi, Dip K. , Ramesh, Rahul , Yu, Neung-Kyung , Son, Kirak , Tsugawa, Tomohiro , Ohtake, Shigeyuki , et al

Article Issue Date2021-07 View137
Characteristics of Plasma-Enhanced Atomic Layer Deposited RuSiN as a Diffusion Barrier against Cu File

Eom, Tae-Kwang , Kim, Soo-Hyun , Kang, Dae-Hwan , Kim, Hoon

Article Issue Date2011-11 View76
Nucleation kinetics of Ru on silicon oxide and silicon nitride surfaces deposited by atomic layer deposition File

Yim, Sung-Soo , Lee, Do-Joong , Kim, Ki-Su , Kim, Soo-Hyun , Yoon, Tae-Sik , Kim, Ki-Bum

Article Issue Date2008-06 View93
Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating File

Choi, Sang-Hyeok , Cheon, Taehoon , Kim, Soo-Hyun , Kang, Dae-Hwan , Park, Gye-Soon , Kim, Sunjung

Article Issue Date2011-03 View92
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