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Highly Conformal Amorphous W-Si-N Thin Films by Plasma-Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization File

Hong, Tae Eun , Jung, Jae-Hun , Yeo, Seungmin , Cheon, Taehoon , Bae, So Ik , Kim, Soo-Hyun , Yeo, So Jeong , Kim, Hyo-Suk , Chung, Taek-Mo , Park, Bo Keun , et al

Article Issue Date2015-01 View37
Highly-conformal nanocrystalline molybdenum nitride thin films by atomic layer deposition as a diffusion barrier against Cu File

Jang, Yujin , Kim, Jun Beom , Hong, Tae Eun , Yeo, So Jeong , Lee, Sunju , Jung, Eun Ae , Park, Bo Keun , Chung, Taek-Mo , Kim, Chang Gyoun , Lee, Do-Joong , et al

Article Issue Date2016-04 View35
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