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Atomic layer deposition of high-quality Pt thin film as an alternative interconnect replacing Cu File

Han, Seung-Min , Nandi, Dip K. , Joo, Yong-Hwan , Shigetomi, Toshiyuki , Suzuki, Kazuharu , Nabeya, Shunichi , Harada, Ryosuke , Kim, Soo-Hyun

Article Issue Date2020-05 View76
Atomic Layer Deposition of Iridium Using a Tricarbonyl Cyclopropenyl Precursor and Oxygen File

Park, Na-Yeon , Kim, Minsu , Kim, Youn-Hye , Ramesh, Rahul , Nandi, Dip K. , Tsugawa, Tomohiro , Shigetomi, Toshiyuki , Suzuki, Kazuharu , Harada, Ryosuke , Kim, Miso , et al

Article Issue Date2022-02 View189
Small and Simple Molecular Structure Based Thermally Stable Ruthenium Precursor in Advancing Ruthenium ALD Process for Scaled Interconnect Metallization File File

Nakatsubo, Hideaki , Mohapatra, Debananda , Lee, Eun-soo , Kim, Jeongha , Cho, Iaan , Iseki, Masato , Shigetomi, Toshiyuki , Harada, Ryosuke , Na, Sang-woong , Cheon, Taehoon , et al

Article Issue Date2026-02 View23
Ultralow Loading (Single-Atom and Clusters) of the Pt Catalyst by Atomic Layer Deposition Using Dimethyl ((3,4-eta) N,N-dimethyl-3-butene-1-amine-N) Platinum (DDAP) on the High-Surface-Area Substrate for Hydrogen Evolution Reaction File

Ramesh, Rahul , Han, Seungmin , Nandi, Dip K. , Sawant, Sandesh Y. , Kim, Deok Hyun , Cheon, Taehoon , Cho, Moo Hwan , Harada, Ryosuke , Shigetomi, Toshiyuki , Suzuki, Kazuharu , et al

Article Issue Date2021-02 View91
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