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A bilayer diffusion barrier of Ru/WSixNy for advanced Cu interconnects File

Eom, Tae-Kwang , Sari, Windu , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Woo Kyoung

Article Issue Date2012-10 View87
Improvement of the Diffusion Barrier Performance of Ru by Incorporating a WNx Thin Film for Direct-Plateable Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Jeon, Chan-Wook , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-04 View113
Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2 File File

Eom, Tae-Kwang , Sari, Windu , Choi, Kyu-Jeong , Shin, Woong-Chul , Kim, Jae Hyun , Lee, Do-Joong , Kim, Ki-Bum , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-08 View87
Plasma Enhanced Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and NH3 Plasma File

Sari, Windu , Eom, Tae-Kwang , Kim, Soo-Hyun , Kim, Hoon

Article Issue Date2010-11 View79
Ru/WNx Bilayers as Diffusion Barriers for Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Choi, Sang-Hyeok , Kim, Soo-Hyun

Article Issue Date2011-05 View103
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