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Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse File

Kim, Jinwoo , Murali, Gauthaman , Park, Heechun , Qin, Eric , Kwon, Hyoukjun , Chekuri, Venkata Chaitanya Krishna , Rahman, Nael Mizanur , Dasari, Nihar , Singh, Arvind , Lee, Minah , et al

Article Issue Date2020-11 View109
Generative Design of Electromagnetic Structures Through Bayesian Learning File

Patel, Ramesh , Roy, Kallol , Choi, Jaesik , Han, Ki Jin

Article Issue Date2018-03 View95
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