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Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse File

Kim, Jinwoo , Murali, Gauthaman , Park, Heechun , Qin, Eric , Kwon, Hyoukjun , Chekuri, Venkata Chaitanya Krishna , Rahman, Nael Mizanur , Dasari, Nihar , Singh, Arvind , Lee, Minah , et al

Article Issue Date2020-11 View24
Clock Delivery Network Design and Analysis for Interposer-Based 2.5-D Heterogeneous Systems File

Murali, Gauthaman , Park , Heechun , Qin, Eric , Torun, Hakki Mert , Dolatsara, Majid Ahadi , Swaminathan, Madhavan , Krishna, Tushar , Lim, Sung Kyu

Article Issue Date2021-04 View13
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