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Atomic layer deposition of Ru thin film using N-2/H-2 plasma as a reactant File

Hong, Tae Eun , Mun, Ki-Yeung , Choi, Sang-Kyung , Park, Ji-Yoon , Kim, Soo-Hyun , Cheon, Taehoon , Kim, Woo Kyoung , Lim, Byoung-Yong , Kim, Sunjung

Article Issue Date2012-07 View115
Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization File

Yeo, Seungmin , Choi, Sang-Hyeok , Park, Ji-Yoon , Kim, Soo-Hyun , Cheon, Taehoon , Lim, Byoung-Yong , Kim, Sunjung

Article Issue Date2013-11 View67
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect File

Mun, Ki-Yeung , Hong, Tae Eun , Cheon, Taehoon , Jang, Yujin , Lim, Byoung-Yong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2014-07 View72
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