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Biodegradable Metallic Glass for Stretchable Transient Electronics File File

Bae, Jae-Young , Gwak, Eun-Ji , Hwang, Gyeong-Seok , Hwang, Hae Won , Lee, Dong-Ju , Lee, Jong-Sung , Joo, Young-Chang , Sun, Jeong-Yun , Jun, Sang Ho , Ok, Myoung-Ryul , et al

Article Issue Date2021-05 View101
Surface residual stress in amorphous SiO2 insulating layer on Si substrate near a Cu through-silicon via (TSV) investigated by nanoindentation File

Kim, Hangeul , Jeon, Hansol , Lee, Dong-Ju , Kim, Ju-Young

Article Issue Date2021-11 View131
나노인덴테이션을 통한 구리 TSV 잔류응력의 측정 및 형성조건에 따른 분포 평가

Lee, Dong-Ju , Kim, Hangeul , Kim, Ju-Young

Conference Paper Issue Date2020-10-28 View88
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