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Browsing by Author : Kweon. Minjeong

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Plasma-enhanced atomic layer deposited highly conductive niobium carbide thin films as next-generation diffusion barriers for Cu and Ru interconnects

Kim, Soo-Hyun , Kim, Sang Bok , Kweon. Minjeong , Park, Chaehyun

Conference Paper Issue Date2024-10-18 View82
YxC thin films prepared by plasma enhanced atomic layer deposition as a diffusion barrier and glue layer for Cu & Ru interconnects

Kweon. Minjeong , Park, Chaehyun , Kim, Sang Bok , Kim, Soo-Hyun

Conference Paper Issue Date2024-08-06 View71
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