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Measurement of adhesion energy by double cantilever beam (DCB) test taking into account machine complience

Kim, Dong-Hyeon , Kwak. Ji-Youn , Kim, Ju-Young

Conference Paper Issue Date2024-11-07 View40
Reliability analysis of polymer-based copper redistribution layers (RDL) in advanced packaging technologies

Kwak. Ji-Youn , Cherry, Emmanuel , Bertheau, Julien , Slabbekoorn, John , Messemaeker, Joke De , Beyne, Eric , Kim, Ju-Young

Conference Paper Issue Date2024-11-07 View33
Reliability Investigations of Polymer Based Redistribution Layers(RDL)

Kwak. Ji-Youn , Chery, Emmanuel , Slabbekoorn, John , Bertheau, Julien , Messemaeker, Joke De , Jeon, Eun-chae , Kim, Ju-Young

Conference Paper Issue Date2023-10-26 View66
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