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A bilayer diffusion barrier of ALD-Ru/ALD-TaCN for direct plating of Cu File

Kim, Soo-Hyun , Kim, Hyun Tae , Yim, Sung-Soo , Lee, Do-Joong , Kim, Ki-Su , Kim, Hyun-Mi , Kim, Ki-Bum , Sohn, Hyunchul

Article Issue Date2008-06 View28
Controlling spatial density and size of nanocrystals by two-step atomic layer deposition File

Lee, Do-Joong , Yim, Sung-Soo , Kim, Ki-Su , Kim, Soo-Hyun , Kim, Ki-Bum

Article Issue Date2011-03 View35
Diffusion barriers between Al and Cu for the Cu interconnect of memory devices File

Kim, Soo-Hyun , Yim, Sung-Soo , Lee, Do-Joong , Kim, Ki-Su , Kim, Hyun-Mi , Kim, Ki-Bum , Sohn, Hyunchul

Article Issue Date2008-03 View44
Nonvolatile memory characteristics of atomic layer deposited Ru nanocrystals with a SiO2/Al2O3 bilayered tunnel barrier File

Lee, Do-Joong , Yim, Sung-Soo , Kim, Ki-Su , Kim, Soo-Hyun , Kim, Ki-Bum

Article Issue Date2010-01 View40
Nucleation kinetics of Ru on silicon oxide and silicon nitride surfaces deposited by atomic layer deposition File

Yim, Sung-Soo , Lee, Do-Joong , Kim, Ki-Su , Kim, Soo-Hyun , Yoon, Tae-Sik , Kim, Ki-Bum

Article Issue Date2008-06 View36
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