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Cu direct electrodeposition using step current for superfilling on Ru-Al2O3 layer File

Kim, Myung Jun , Choe, Seunghoe , Kim, Hoe Chul , Lee, Seung-Joon , Kim, Soo-Hyun , Kwon, Oh Joong , Kim, Jae Jeong

Article Issue Date2014-11 View16
Direct Electrodeposition of Cu on Ru-Al2O3 Layer File

Kim, Myung Jun , Kim, Hoe Chul , Kim, Soo-Hyun , Yeo, Seungmin , Kwon, Oh Joong , Kim, Jae Jeong

Article Issue Date2013-01 View15
Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology File

Hong, Tae Eun , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Jeong-Kyu , Park, Young-Bae , Kwon, Oh Joong , Kim, Myung Jun , Kim, Jae Jeong

Article Issue Date2013-12 View15
Electrochemical porosimetry: Deconvolution of distribution functions File

Song, Hyun-Kon , Jang, Jong H. , Kim, Jae Jeong , Oh, Seung M.

Article Issue Date2006-07 View114
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