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Distribution and Diffusion of Water in Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach File

Lee, Seung Geol , Jang, Seung Soon , Kim, Jongman , Kim, Gene

Article Issue Date2010-05 View46
Effect of Temperature on Water Molecules in a Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach File

Lee, Seung Geol , Choi, Ji Il , Koh, Wonsang , Jang, Seung Soon , Kim, Jongman , Kim, Gene

Article Issue Date2011-10 View44
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