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Showing results 1 to 20 of 57

Issue DateTitleAuthor(s)TypeView
2012-05-3032 nm FinFET-based 0.7-to-1.1 V digital voltage sensor with 50 mV resolutionKim, Youngmin; Nguyen, HVCONFERENCE16
2013-05A high resolution and high linearity 45 nm CMOS fully digital voltage sensor for low power applicationsRyu, Myunghwan; Kim, YoungminARTICLE713
2016-10-26A novel design methodology for error-resilient circuits in near-Threshold computingLee, Jaemin; Kim, Sunmean; Kim, Youngmin; Kang, SeokhyeongCONFERENCE23
2012-02A novel methodology for speeding up IC performance in 32nm FinFETNguyen, Hung Viet; Ryu, Myunghwan; Kim, YoungminARTICLE633
2014-10A performance analysis for interconnections of 3D ICs with frequency-dependent TSV model in S-parameterHan, Ki Jin; Lim, Younghyun; Kim, YoungminARTICLE654
2017-08-30A preliminary analysis of domain coupling in package power distribution networkBae, Byoungjin; Kim, Seungwon; Kim, Youngmin; Kang, Seokhyeong; Kim, Il Joon; Kim, Kwangseok; Kang, Sunwon; Han, Ki JinCONFERENCE31
2012A Simple and Accurate Modeling of Non-rectilinear Gate Shape with Trapezoidal ApproximationKim, YoungminCONFERENCE16
2018-04A Theoretically Sound Approach to Analog Circuit SizingLim, Eunji; Choi, Jaehyouk; Kim, YoungminARTICLE287
2015-09A Wide Range On-Chip Leakage Sensor Using a Current-Frequency Converting Technique in 65-nm Technology NodeChoi, Jaehyouk; Kang, Yesung; Kim, YoungminARTICLE870
2015-10-05An optimal operating point by using error monitoring circuits with an error-resilient techniqueLee, Jaemin; Kim, Seungwon; Kim, Youngmin; Kang, SeokhyeongCONFERENCE27
2017-09Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery networkKim, Seungwon; Kim, YoungminARTICLE288
2014-11-05Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV modelsKim, Seungwon; Han, Ki Jin; Kang, Seokhyeong; Kim, YoungminCONFERENCE20
2014-11-05Analysis of On Chip Decoupling Capacitor in the Double-gate FinFETs with PEEC-based Power Delivery NetworksLee, Jaemin; Kang, Yesung; Kim, YoungminCONFERENCE24
2014-02Analysis of power integrity of multi-layer 3D IC with PEEC-based PDNHan, Ki Jin; Kim, Seungwon; Kim, YoungminCONFERENCE18
2014-11-05Analysis of Structural Variation and Threshold Voltage Modulation in 10-nm Double Gate-All-Around (DGAA) TransistorRyu, Myunghwan; Kim, YoungminCONFERENCE19
2014-12Comprehensive Performance Analysis of Interconnect Variation by double and triple patterning lithography processesKim, Youngmin; Lee, Jaemin; Ryu, MyunghwanARTICLE604
2015-02Cryptography Engine Design for IEEE 1609.2 WAVE Secure Vehicle Communication using FPGAKim, Youngmin; Jeong, ChanbokMaster's thesis1684
2011-11Diffusion-rounded CMOS for improving both I-on and I-off characteristicsRyu, Myunghwan; Nguyen, Hung Viet; Kim, YoungminARTICLE661
2011Effects of Contact Size and Schottky Barrier Height on Nanoscale ContactKim, YoungminCONFERENCE10
2018-03-19Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case studyKim, Seungwon; Han, Ki Jin; Kim, Youngmin; Kang, SeokhyeongCONFERENCE32
Showing results 1 to 20 of 57