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Showing results 1 to 6 of 6

Issue DateTitleAuthor(s)TypeView
2012-02-22A 1920x1080 3.65μm-Pixel 2D/3D Image Sensor with Split and Binning Pixel Structure in 0.11μm Standard CMOSKim, Seong-Jin; Kang, Byongmin; Kim, James D. K.; Lee, Keechang; Kim, Chang-Yeong; Kim, KinamCONFERENCE42
2014-10A 3-D Camera With Adaptable Background Light Suppression Using Pixel-Binning and Super-ResolutionCho, Jihyun; Choi, Jaehyuk; Seong-Jin Kim; Shin, Jungsoon; Park, Seokjun; Kim, James D. K.; Yoon, EuisikARTICLE730
2010-11A 3-D Time-of-Flight CMOS Image Sensor with Pinned-Photodiode Pixel StructureKim, Seong-Jin; Han, Sang-Wook; Kang, Byongmin; Lee, Keechang; Kim, James D. K.; Kim, Chang-YeongARTICLE740
2013-06-12A 5.9μm-pixel 2D/3D Image Sensor with Background Suppression Over 100klxCho, Jihyun; Choi, Jaehyuk; Kim, Seong-Jin; Shin, Jungsoon; Park, Seokjun; Kim, James D. K.; Yoon, EuisikCONFERENCE59
2011-06-15A 640x480 Image Sensor with Unified Pixel Architecture for 2D/3D Imaging in 0.11μm CMOSKim, Seong-Jin; Kim, James D. K.; Han, Sang-Wook; Kang, Byongmin; Lee, Keechang; Kim, Chang-YeongCONFERENCE45
2012-11A CMOS Image Sensor Based on Unified Pixel Architecture with Time-Division Multiplexing Scheme for Color and Depth Image AcquisitionKim, Seong-Jin; Kim, James D. K.; Kang, Byongmin; Lee, KeechangARTICLE730
Showing results 1 to 6 of 6

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