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Effects of the TiN diffusion barrier and post-annealing between Ru and SiO2 films on the interfacial adhesion energy for advanced interconnections File

Son, Kirak , Kim, Gahui , Jeong, Daeyoon , Kim, Soo-Hyun , Park, Young-Bae

Article Issue Date2025-03 View116
Self‐Formation of a Ru/ZnO Multifunctional Bilayer for the Next‐Generation Interconnect Technology via Area‐Selective Atomic Layer Deposition File File

Mori, Yuki , Cheon, Taehoon , Kotsugi, Yohei , Kim, Youn‐Hye , Park, Yejin , Ansari, Mohd Zahid , Mohapatra, Debananda , Jang, Yujin , Bae, Jong‐Seong , Kwon, Woobin , et al

Article Issue Date2023-08 View136
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