Showing results 1 to 4 of 4
| Issue Date | Title | Author(s) | Type | View |
| 2012-02-22 | A 1920x1080 3.65μm-Pixel 2D/3D Image Sensor with Split and Binning Pixel Structure in 0.11μm Standard CMOS | Kim, Seong-Jin; Kang, Byongmin; Kim, James D. K.; Lee, Keechang; Kim, Chang-Yeong; Kim, Kinam | CONFERENCE | 24 |
| 2010-11 | A 3-D Time-of-Flight CMOS Image Sensor with Pinned-Photodiode Pixel Structure | Kim, Seong-Jin; Han, Sang-Wook; Kang, Byongmin; Lee, Keechang; Kim, James D. K.; Kim, Chang-Yeong | ARTICLE | 678 |
| 2011-06-15 | A 640x480 Image Sensor with Unified Pixel Architecture for 2D/3D Imaging in 0.11μm CMOS | Kim, Seong-Jin; Kim, James D. K.; Han, Sang-Wook; Kang, Byongmin; Lee, Keechang; Kim, Chang-Yeong | CONFERENCE | 28 |
| 2012-11 | A CMOS Image Sensor Based on Unified Pixel Architecture with Time-Division Multiplexing Scheme for Color and Depth Image Acquisition | Kim, Seong-Jin; Kim, James D. K.; Kang, Byongmin; Lee, Keechang | ARTICLE | 694 |
Showing results 1 to 4 of 4
