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Atomic layer deposited Mo2N thin films using Mo(CO)(6) and NH3 plasma as a Cu diffusion barrier File File

Joo, Yong-Hwan , Nandi, Dip K. , Ramesh, Rahul , Jang, Yujin , Bae, Jong-Seong , Cheon, Taehoon , Kim, Soo-Hyun

Article Issue Date2021-03 View98
Atomic layer deposition of high-quality Pt thin film as an alternative interconnect replacing Cu File

Han, Seung-Min , Nandi, Dip K. , Joo, Yong-Hwan , Shigetomi, Toshiyuki , Suzuki, Kazuharu , Nabeya, Shunichi , Harada, Ryosuke , Kim, Soo-Hyun

Article Issue Date2020-05 View76
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