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Influence of additives upon Cu thin film growth on atomic-layer-deposited Ru layer and trench-filling by direct electrodeposition File

Im, Byoungyong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2017-08 View20
Nucleation-controlled growth of Cu thin films electrodeposited directly on ALD Ru diffusion barrier in additive-free electrolyte for Cu interconnect File

Im, Byoungyong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2023-04 View28
Seedless electrodeposition of Cu thin films on ALD Ru diffusion barriers with different electrical properties File

Im, Byoungyong , Mun, Kiyeung , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2023-03 View33
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