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A Parametric Study on Interfacial Bond Strength in Cu/SiCN Hybrid Bonding: A Multiscale Approach File

Jang, Minki

Thesis Issue Date2025-08 View32
AI Augmented Digital Metal Component

Seo, Eunhyeok , Sung, Hyokyung , Kim, Hayeol , Kim, Taekyeong , Park, Sangeun , Lee, Minsik , Moon, Seung Ki , Kim, Jung Gi , Chung, Hayoung , Choi, Seong-Kyum , et al

Conference Paper Issue Date2021-10-29 View73
Efficient domain integration of enriched elements using the moment fitting method enhanced by neural network File File

Kang, Taehun

Thesis Issue Date2022-02 View71
Phase-guided approach for elastic metasurface through achromatic principle File File

Kim, Do Hyeong

Thesis Issue Date2024-08 View102
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