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Atomic Layer Deposition of RuAlO Thin Films as a Diffusion Barrier for Seedless Cu Interconnects File

Cheon, Taehoon , Choi, Sang-Hyeok , Kim, Soo-Hyun , Kang, Dae-Hwan

Article Issue Date2011-03 View80
Atomic layer deposition of ruthenium (Ru) thin films using ethylbenzen-cyclohexadiene Ru(0) as a seed layer for copper metallization File

Yeo, Seungmin , Choi, Sang-Hyeok , Park, Ji-Yoon , Kim, Soo-Hyun , Cheon, Taehoon , Lim, Byoung-Yong , Kim, Sunjung

Article Issue Date2013-11 View70
Ru/WNx Bilayers as Diffusion Barriers for Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Choi, Sang-Hyeok , Kim, Soo-Hyun

Article Issue Date2011-05 View94
Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating File

Choi, Sang-Hyeok , Cheon, Taehoon , Kim, Soo-Hyun , Kang, Dae-Hwan , Park, Gye-Soon , Kim, Sunjung

Article Issue Date2011-03 View92
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