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Reliability analysis of polymer-based copper redistribution layers (RDL) in advanced packaging technologies

Kwak. Ji-Youn , Cherry, Emmanuel , Bertheau, Julien , Slabbekoorn, John , Messemaeker, Joke De , Beyne, Eric , Kim, Ju-Young

Conference Paper Issue Date2024-11-07 View31
Reliability investigations of Polymer-based Redistribution Layers (RDL

곽지윤 , Cherry, Emmanuel , Slabbekoornm, John , Bertheau, Julien , Messemaeker, Joke De , Beyne, Eric , Kim, Ju-Young

Conference Paper Issue Date2024-04-24 View62
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