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Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies Using RF Impedance Analysis File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Conference Paper Issue Date2009-05-26 View39
Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Article Issue Date2009-06 View95
Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Humidity-Bias Testing Conditions Using Non-Linear Modeling File File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Article Issue Date2013-09 View63
Nondestructive Sensing of Interconnect Failure Mechanisms Using Time-Domain Reflectometry File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Article Issue Date2011-05 View98
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