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Atomic Layer Deposition of Ru for Replacing Cu-Interconnects File

Kotsugi, Yohei , Han, Seung-Min , Kim, Youn-Hye , Cheon, Taehoon , Nandi, Dip K. , Ramesh, Rahul , Yu, Neung-Kyung , Son, Kirak , Tsugawa, Tomohiro , Ohtake, Shigeyuki , et al

Article Issue Date2021-07 View56
Effects of the TiN diffusion barrier and post-annealing between Ru and SiO2 films on the interfacial adhesion energy for advanced interconnections File

Son, Kirak , Kim, Gahui , Jeong, Daeyoon , Kim, Soo-Hyun , Park, Young-Bae

Article Issue Date2025-03 View41
Interfacial adhesion energies of Ru-Mn direct plateable diffusion barriers prepared by atomic layer deposition for advanced Cu interconnects File

Son, Kirak , Kim, Youn-Hye , Kim, Soo-Hyun , Park, Young-Bae

Article Issue Date2021-08 View51
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