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Showing results 5 to 11 of 11

Diffusion barriers between Al and Cu for the Cu interconnect of memory devices File

Kim, Soo-Hyun , Yim, Sung-Soo , Lee, Do-Joong , Kim, Ki-Su , Kim, Hyun-Mi , Kim, Ki-Bum , Sohn, Hyunchul

Article Issue Date2008-03 View8
Effects of phase of underlying W film on chemical vapor deposited-W film growth and applications to contact-plug and bit line processes for memory devices File

Kim, Soo-Hyun , Kim, Jeong-Tae , Kwak, Nohjung , Kim, Jinwoong , Yoon, Tae-Sik , Sohn, Hyunchul

Article Issue Date2007-09 View4
Emulation of spike-timing dependent plasticity in nano-scale phase change memory File

Kang, Dae-Hwan , Jun, Hyun-Goo , Ryoo, Kyung-Chang , Jeong, Hongsik , Sohn, Hyunchul

Article Issue Date2015-05 View9
Improvement of the Diffusion Barrier Performance of Ru by Incorporating a WNx Thin Film for Direct-Plateable Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Jeon, Chan-Wook , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-04 View5
Low Temperature Atomic Layer Deposition of Ruthenium Thin Films Using Isopropylmethylbenzene-Cyclohexadiene-Ruthenium and O-2 File

Eom, Tae-Kwang , Sari, Windu , Choi, Kyu-Jeong , Shin, Woong-Chul , Kim, Jae Hyun , Lee, Do-Joong , Kim, Ki-Bum , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-08 View4
Phase and microstructure of ALD-W films deposited using B2H6 and WF6 and their effects on CVD-W growth File

Kim, Soo-Hyun , Yeom, Seung-Jin , Kwak, Nohjung , Sohn, Hyunchul

Article Issue Date2007-12 View9
Pulsed CVD of tungsten thin film as a nucleation layer for tungsten plug-fill File

Kim, Soo-Hyun , Hwang, Eui-Sung , Han, Sang-Yup , Pyi, Seung-Ho , Kawk, Nohjung , Sohn, Hyunchul , Kim, Jinwoong , Choi, Gi Bo

Article Issue Date2004-08 View3
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