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Atomic Layer Deposition of Ru for Replacing Cu-Interconnects File

Kotsugi, Yohei , Han, Seung-Min , Kim, Youn-Hye , Cheon, Taehoon , Nandi, Dip K. , Ramesh, Rahul , Yu, Neung-Kyung , Son, Kirak , Tsugawa, Tomohiro , Ohtake, Shigeyuki , et al

Article Issue Date2021-07 View17
Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology File

Hong, Tae Eun , Cheon, Taehoon , Kim, Soo-Hyun , Kim, Jeong-Kyu , Park, Young-Bae , Kwon, Oh Joong , Kim, Myung Jun , Kim, Jae Jeong

Article Issue Date2013-12 View15
Interfacial adhesion energies of Ru-Mn direct plateable diffusion barriers prepared by atomic layer deposition for advanced Cu interconnects File

Son, Kirak , Kim, Youn-Hye , Kim, Soo-Hyun , Park, Young-Bae

Article Issue Date2021-08 View17
Interfacial Adhesion Energy of Ru-AlO Thin Film Deposited by Atomic Layer Deposition between Cu and SiO2: Effect of the Composition of Ru-AlO Thin Film File

Kim, Jeong-Kyu , Cheon, Tae-Hoon , Kim, Soo-Hyun , Park, Young-Bae

Article Issue Date2012-05 View18
후속열처리 및 고온고습 조건에 따른 Cu 배선 확산 방지층 적용을 위한ALD RuAlO 박막의 계면접착에너지에 관한 연구 File

Lee, Hyeonchul , Jeong, Minsu , Bae, Byung-Hyun , Cheon, Taehun , Kim, Soo-Hyun , Park, Young-Bae

Article Issue Date2016-06 View15
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