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Showing results 10 to 16 of 16

Improvement of the Diffusion Barrier Performance of Ru by Incorporating a WNx Thin Film for Direct-Plateable Cu Interconnects File

Sari, Windu , Eom, Tae-Kwang , Jeon, Chan-Wook , Sohn, Hyunchul , Kim, Soo-Hyun

Article Issue Date2009-04 View7
Material Characterization of Single Crystalline Cu Subjected to High Strain Rates and High Temperatures for Multiscale Simulation File

Seong, Yujin , Kim, Youngkyu , Jung, Im Doo , Kim, Sungho , Kim, See Jo , Kim, Seong-Gon , Kim, Hak Jun , Park, Seong Jin

Article Issue Date2017-11 View5
Mechanistic approaches for chemically modifying the coordination sphere of copper-amyloid-beta complexes File

Han, Jiyeon , Lee, Hyuck Jin , Kim, Kyu Yeon , Nam, Geewoo , Chae, Junghyun , Lim, Mi Hee

Article Issue Date2020-03 View6
Miscibility of polyimide with polymeric primer and its influence on adhesion of polyimide to the primed copper metal: Effect of precursor origin File

Yu, J , Ree, M , Shin, TJ , Wang, X , Cai, W , Zhou, D , Lee, KW

Article Issue Date1999-10 View11
Plasma-Enhanced Atomic Layer Deposition of TaCx Films Using Tris(neopentyl) Tantalum Dichloride and H-2 Plasma File

Kim, Tae-Ho , Eom, Tae-Kwang , Kim, Soo-Hyun , Kang, Dae-Hwan , Kim, Hoon , Yu, Sangho , Lim, Jin Mook

Article Issue Date2011-05 View6
Selective mechanical transfer of graphene from seed copper foil using rate effects File

Na, Seung Ryul , Suk, Ji Won , Tao, Li , Akinwande, Deji , Ruoff, Rodney S. , Huang, Rui , Liechti, Kenneth M.

Article Issue Date2015-02 View6
Synthesis of Main-Chain Poly(carbazole)s via CuAAC File

Chen, Zheng , Dreyer, Daniel R. , Wu, Zong-Quan , Wiggins, Kelly M. , Jiang, Zhenhua , Bielawski, Christopher W.

Article Issue Date2011-03 View3
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