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Showing results 15 to 27 of 27

Hybrid simulations of the heating of heavy ion species by ion beams

Kim, Sunjung , Ryu, Dongsu

Conference Paper Issue Date2023-10-18 View12
Influence of additives upon Cu thin film growth on atomic-layer-deposited Ru layer and trench-filling by direct electrodeposition File

Im, Byoungyong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2017-08 View15
Low frequency electromagnetic fluctuations in Kappa magnetized plasmas File

Kim, Sunjung , Lazar, M. , Schlickeiser, R. , Lopez, R. A. , Yoon, P. H.

Article Issue Date2018-07 View6
Microinstabilities at quasi-perpendicular shocks in high-β ICM

Kim, Sunjung , Ha, Ji-Hoon , Ryu, Dongsu , Kang, Hyesung

Conference Paper Issue Date2021-09-28 View12
Microinstabilities at Quasi-Perpendicular Shocks in the High Beta ICM

Kim, Sunjung , Ha, Ji-Hoon , Kang, Hyesung , Ryu, Dongsu

Conference Paper Issue Date2020-10-16 View10
Microinstabilities in the Transition Region of Weak Quasi-perpendicular Intracluster Shocks File File

Kim, Sunjung , Ha, Ji-Hoon , Ryu, Dongsu , Kang, Hyesung

Article Issue Date2021-05 View17
Nucleation-controlled growth of Cu thin films electrodeposited directly on ALD Ru diffusion barrier in additive-free electrolyte for Cu interconnect File

Im, Byoungyong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2023-04 View20
Preexsiting Suprathermal Electrons and Preacceleration at Quasi-Perpendicular Shocks in Merging Galaxy Clusters

Ha, Ji-Hoon , Ryu, Dongsu , Kang, Hyesung , Kim, Sunjung

Conference Paper Issue Date2021-10-14 View8
Preliminary results on the heating of ion species in hybrid simulations of wave-particle interaction

Ryu, Dongsu , Kim, Sunjung

Conference Paper Issue Date2023-06-20 View18
Seedless electrodeposition of Cu thin films on ALD Ru diffusion barriers with different electrical properties File

Im, Byoungyong , Mun, Kiyeung , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2023-03 View23
Shock Waves in the Hot Plasma of Galaxy Clusters

Ryu, Dongsu , Ha, Ji-Hoon , Kim, Sunjung , Lee, Eunyu , Kang, Hyesung

Conference Paper Issue Date2023-11-16 View22
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect File

Mun, Ki-Yeung , Hong, Tae Eun , Cheon, Taehoon , Jang, Yujin , Lim, Byoung-Yong , Kim, Sunjung , Kim, Soo-Hyun

Article Issue Date2014-07 View15
Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating File

Choi, Sang-Hyeok , Cheon, Taehoon , Kim, Soo-Hyun , Kang, Dae-Hwan , Park, Gye-Soon , Kim, Sunjung

Article Issue Date2011-03 View7
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