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DC Field | Value | Language |
---|---|---|
dc.citation.endPage | 72 | - |
dc.citation.number | 1 | - |
dc.citation.startPage | 70 | - |
dc.citation.title | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | - |
dc.citation.volume | 25 | - |
dc.contributor.author | Jeong, Jongwoo | - |
dc.contributor.author | Kim, Jingook | - |
dc.contributor.author | Kang, No-Weon | - |
dc.contributor.author | Han, Ki Jin | - |
dc.date.accessioned | 2023-12-22T01:44:27Z | - |
dc.date.available | 2023-12-22T01:44:27Z | - |
dc.date.created | 2015-01-05 | - |
dc.date.issued | 2015-01 | - |
dc.description.abstract | This letter proposes a new indirect contact probing method to characterize vertical interconnections without contact damage. At the first step of the proposed technique, multiple one-port calibration measurements should be performed to characterize the contactor layer between the probe pads and the device-under-tests (DUTs). The characteristics of the actual vias as the DUTs are then extracted from indirect-contact measurements by de-embedding the contactor layer. In simulations and experiments at frequencies range from 2.5 to 18 GHz, we have verified via defects can be successfully identified from the indirect-contact measurements. | - |
dc.identifier.bibliographicCitation | IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.25, no.1, pp.70 - 72 | - |
dc.identifier.doi | 10.1109/LMWC.2014.2369951 | - |
dc.identifier.issn | 1531-1309 | - |
dc.identifier.scopusid | 2-s2.0-84920881722 | - |
dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/9813 | - |
dc.identifier.url | https://ieeexplore.ieee.org/document/6960922 | - |
dc.identifier.wosid | 000347695700024 | - |
dc.language | 영어 | - |
dc.publisher | IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC | - |
dc.title | Indirect Contact Probing Method for Characterizing Vertical Interconnections in Electronic Packaging | - |
dc.type | Article | - |
dc.description.isOpenAccess | FALSE | - |
dc.relation.journalWebOfScienceCategory | Engineering, Electrical & Electronic | - |
dc.relation.journalResearchArea | Engineering | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.subject.keywordAuthor | Calibration | - |
dc.subject.keywordAuthor | de-embedding | - |
dc.subject.keywordAuthor | non-contact measurement | - |
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