File Download

There are no files associated with this item.

  • Find it @ UNIST can give you direct access to the published full text of this article. (UNISTARs only)
Related Researcher

김진국

Kim, Jingook
Integrated Circuit and Electromagnetic Compatibility Lab.
Read More

Views & Downloads

Detailed Information

Cited time in webofscience Cited time in scopus
Metadata Downloads

Modeling and measurement of interlevel electromagnetic coupling and fringing effect in a hierarchical power distribution network using segmentation method with resonant cavity model

Author(s)
Kim, JaeminJeong, YouchulKim, JingookLee, JunhoRyu, ChunghyunShim, JongjooShin, MinchulKim, Joungho
Issued Date
2008-08
DOI
10.1109/TADVP.2008.927837
URI
https://scholarworks.unist.ac.kr/handle/201301/8007
Fulltext
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=65349159978
Citation
IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.31, no.3, pp.544 - 557
Abstract
A hierarchical power distribution network (PDN) consists of chip, package, and printed circuit board (PCB) level PDNs, as well as various structures such as via, ball, and wire bond interconnections, which connect the different level PDNs. When estimating the simultaneous switching noise (SSN) generation and evaluating PDN designs, PDN impedance calculation is an efficient criterion. In this paper, we introduce two new kinds of modeling approaches that are exceptionally suited to improving the accuracy of the PDN impedance estimation, especially for hierarchical PDN. First, we propose a modeling procedure to add an interlevel electromagnetic coupling effect between PDNs of different levels, based on the resonant cavity model and segmentation method In order to effectively consider the interlevel electromagnetic pling effect, we introduce a new concept of interlevel PDN, which is, for example, composed of a metal plate in the package-level PDN and a metal plate in the PCB-level PDN. Next, we present a modeling procedure to include the fringing field effect at the edge of small-size PDN structure, which causes a considerable shift of cavity resonance frequencies in the PDN impedance profile. In order to verify the proposed modeling approaches, we have fabricated a series of test vehicles by combining two package-level PDN designs with a PCB-level PDN design. Finally, we have successfully validated the proposed modeling approaches with a series of frequency-domain measurements in a frequency range up to 5 GHz.
Publisher
Institute of Electrical and Electronics Engineers
ISSN
1521-3323
Keyword (Author)
fringing effecthierarchical power distribution network (PDN)interlevel electromagnetic couplinginterlevel PDNPDN impedanceresonant cavity segmentation methodsimultaneous switching noise (SSN)
Keyword
PRINTED-CIRCUIT BOARDSPLANAR CIRCUITSBUS IMPEDANCEPACKAGESIGNAL

qrcode

Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.