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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | KO | - |
| dc.citation.title | ICT2019 - 38th International Conference on Thermoelectrics | - |
| dc.contributor.author | Son, Jae Sung | - |
| dc.contributor.author | Jo, Seungki | - |
| dc.contributor.author | Kim, Fredrick | - |
| dc.contributor.author | Heo, Seung Hwae | - |
| dc.contributor.author | Choo, Seungjun | - |
| dc.contributor.author | Yang, Seong Eun | - |
| dc.date.accessioned | 2024-02-01T00:07:17Z | - |
| dc.date.available | 2024-02-01T00:07:17Z | - |
| dc.date.created | 2020-01-03 | - |
| dc.date.issued | 2019-07-02 | - |
| dc.identifier.bibliographicCitation | ICT2019 - 38th International Conference on Thermoelectrics | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/79550 | - |
| dc.publisher | International Thermoelectric Society | - |
| dc.title | Ink processing for thermoelectric materials and devices | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2019-06-30 | - |
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