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김명수

Kim, Myungsoo
Nano Electronics and Technology Lab.
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dc.citation.conferencePlace US -
dc.citation.conferencePlace Virtual -
dc.citation.title APS March Meeting -
dc.contributor.author Pallecchi, Emiliano -
dc.contributor.author Kim, Myungsoo -
dc.contributor.author Skrzypczak, Simon -
dc.contributor.author Happy, Henri -
dc.contributor.author Akinwande, Deji -
dc.date.accessioned 2024-01-31T22:07:36Z -
dc.date.available 2024-01-31T22:07:36Z -
dc.date.created 2021-09-08 -
dc.date.issued 2021-03-16 -
dc.description.abstract Recently, non-volatile switching has been observed in various monolayer and multilayer 2D films[1]. In this contribution, we will show that wafer-scale 2D-materials such as MoS2 and hBN can be used for low-power non-volatile switches with applications in communications systems for 5G and 6G. The 2D-based RF switch is a metal-insulator-metal vertical structure made of two electrodes separated by a thin 2D film. It is promising for high-frequency operation because of the favorable scaling compared to other emerging technologies[2].
Owing to the ultimate thickness of the 2D dielectrics, cut-off frequency and switching time figures of merit are superior to those of existing solid state devices. From high-frequency electrical characterization (up to 500GHz, in the THz band) we determine a cut-off frequency figure of merit of 129THz. Furthermore, the switches are 50 times more efficient than other non-volatile switches in terms of a d.c. energy-consumption metric, which is an important consideration for ubiquitous mobile systems. To illustrate the potential of the devices in a real-life application scenario, we operate a switch to route a 125Gbps QAM-32 datastream at 300GHz.
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dc.identifier.bibliographicCitation APS March Meeting -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/77596 -
dc.identifier.url https://meetings.aps.org/Meeting/MAR21/Session/F56.7 -
dc.publisher American Physical Society -
dc.title Non-volatile switches based on 2D materials for 5G/6G applications -
dc.type Conference Paper -
dc.date.conferenceDate 2021-03-15 -

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